Custom DIE Bonders

 

DIE Bonding Systems for the Microelectronics Industry

FS Bondtec logo

ONBoard Solutions represent Infotech Automation AG die bonding machines. This reputable company has been producing high quality equipment for the assembly of microelectronics used in medical devices, high-end military or any miniaturised electronic device packaging application for three decades. Infotech Automation provide semi-automatic, fully automatic and customised die attach machines.

Our company is also proud to offer wire bonding machines from F&S Bondtec. This respected Austrian company has been producing high quality equipment with applications in the microelectronics packaging industry for more than thirty years.

F&S Bondtec supports wire bonding systems suitable for customers in R&D right through to semi-automated production solutions. The machines can be delivered with support for ball bonding, wedge bonding, pull-test and shear-test functionality. F&S Bondtec offers platforms which can include individual or all of the listed functions.

Machines, consumables and supplies for Australia & New Zealand

ONBoard Solutions has been a revered and successful supplier of microelectronic related equipment and consumables including die attach adhesives from Epotek and plasma treatment systems for more than 15 years. Since 2000 we’ve built a strong and well-deserved reputation as a trustworthy partner in industry for many, many Australian companies. We work hand-in-hand with our clients to ensure they get the support and equipment they need to succeed in their chosen field.

For more information on any of our products, get in touch today through our online contact page, or call us at our Melbourne location on +61 3 9015 9850 or in Sydney on +61 2 9695 1030. We are able to provide advice and guidance for our entire range of products, so if you’re unsure whether a piece of equipment or a consumable is right for your business, application or budget, get in touch with our expert staff today.

Infotech Automation

Offers Hi-Precission Assembly platforms up to sub-micron accuracy levels. The ideal partner for any custom specific application in the areas of:

    •    Electronics
    •    Semiconductor
    •    Micromechanic
•  Biotechnology

 

 

 

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Infotech IP 500 Desktop

  
High precision, multi-functional desktop platform with the possibility of adding application specific peripherals from the Infotech Component Matrix. Processes which have been dveloped on IP-Desktop systems, can be transferred to the production line without modifications:

  • Aluminum casting structure with an opening of 560mm
  • Cartesian X- and Y-axes mechanism 400mm x 400mm
  • X- and Y-axes optical linear encoders and linear motors
  • Synchronized motion control system for all axes
  • Highest accuracy dispense- and assembly processes
  • Various assembly tools, nozzles, grippers and dispensers
  • Time pressure, micro screw or jet dispense processes
Infotech IP 500 Production Cell

  
High precision, multi-functional production cell with the possibility of adding application specific peripherals from the Infotech component Matrix. The system uses an open design with easy access to all the possible peripheral areas:

  • Distributed, synchronized motion and vision control system
  • Mutliple up- or down looking, moving or fixed installed cameras
  • Head and table peripharls from flexible component matrix
  • Optional propes dispensers (time/presure, micro-screw and jet dispensing)
  • Optional conveyor, tape and stick feeders, any feed- , wafer and waffle pack feeders

It guarantees made to measure application: highest precission cartesian positioning system with an extensive range of available components for the automation of precission processes.

ONBoard Solutions offers SMT Production Solutions, Inline Printers, PCB printers, SMT assembly machines, Thermal Reflow Ovens, Wave Soldering, Conformal Coating, PCB Cleaning, Rework, Soldering, Desoldering and Rework Stations, Dispensing Units, Fume Extractor, Static Controls, DIE Bonders, Wire Bonders, Dicing Systems, Wafer Mounting System, Precision Cleaning, Lead free Solder Paste, Leaded Solder paste, Solder Wire, Flux, Epoxies, SMT Adhesives, UV Curable, Underfill, Precision Cleaners, Bonding Wire, Capilliary Tubes, Nozzles, Solder Tips, Air Showers, Pass Boxes, Transfer Hatches, Fan Filter Units, Laminar Flow Cabinets, Straddle Units, Modular Clean Rooms, disposable gloves, sterile gloves, ESD chairs, sticky mats, disposable garments, wipers, disinfectants.