DIE Bonders

 

Dr. Tresky AG


Designs and manufactures robust, simple to operate, high quality equipment with a broad spectrum of applications in the field of:

Hybrid                     Flip-Chip              Photonics
SMT                         Die Attach            MCM, COB

      
F&S Bondtec 5380 DIE Bonder

 

F&S’ popular manual wire bonder 53XX BDA was already a marvel of versatility, being extremely simple to convert between wedge and ball-bonding. Now it adds a third functionality: the 53XX BDA is now capable of DIE-bonding.

Bondsystem:

Die-sizes:

  • different sizes process-oriented usable

Bondhead:

  • manual Die-Bonding with Touchdown-Detection and programmable Pickup- and Bondforce
  • different Standard-tools usable
  • Bondforcesystem with Voice-Coil
  • contactless electronic Touchdown-Sensor
  • Vacuum and blow-off-gas automatically switched

Chipsource:

  • optional Wafflepacks, Jellypacks or Trays inside the working area 2×2″ applicable

Substrathandling:

  • manual workholder with vacuum or manual clamping, quick change

Bondforce:

  • Bondforce programmable from 5 to 500cN
  • Pickup-force programmable from 5 to 500cN

 

 

 

 

Tresky T 3202 Semi-automatic DIE Bonder

 

The T-3202 represents a new generation of electronics assembly equipment, featuring highest possible flexibility and enabling a cost effective solution of a broad variety of applications.

The Die Attach System T-3202 is designed for both development and lower or middle productions runs.

Flexible Windows based software and new highly accurate motion control, together with the proved feature of switching from automatic to manual operation at any time provide easy teach-in programming.

Modular structure and a number of optional equipment enable optimal configuration for the user’s requirement, with the upgrade or retrofitting possibility any time.

TRESKY T-3002-FC3 Manual DIE Bonder

A precise, high quality, versatile die bonder & component placer with superior ergonomic design and programmable, high accuracy motorised Z-Drive and bonding force control.
Excellent performance and high reliability makes it ideal for small and medium production and various development applications. The automated Z-Drive with bond force control enables a high repeatability of bond parameters.

The overlapping wafer & bonding levels reduce the necessary worktable movement to a minimum. The special automatic focusing facility compensates the difference between the two microscope working levels. Various video-systems are available for alignment (e.g. Flip-Chip).

Optional equipped with wafer table and die ejector system

TRESKY T-3002-M DIE Bonder with auto Z-Axis

 

Excellent performance, ergonomically designed and high reliability make the T-3002-M ideal for small and medium production, runs with a cycle time of approx. 4 sec. (process depending) and various development applications.

The overlapping wafer & bonding levels reduce the necessary worktable movement to a minimum. The special automatic focusing facility compensates the difference between the two microscope working levels.
Various video-systems are available for alignment (e.g. Flip-Chip option).
The XY-wafer-table is located under the operation table. The XY-positioning knobs enable exact positioning of the dies.

Tresky T 4909 DIE Attach System

T-4909 is a manual, high quality die bonder with
superior ergonomic design. As with all of Tresky’s products,

The T-4909 incorporates True Vertical Technology™ which
guarantees parallelism between chip and substrate at any
bond height.

Tresky Hot Plates

Various Euthectic Hotplates are available for:

Tool Heating, Curing including Gas Controller, Hot Jet and Temperature Controllers

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