DIE Bonders

F&S Bondtec 5380 DIE Bonder

 

F&S’ popular manual wire bonder 53XX BDA was already a marvel of versatility, being extremely simple to convert between wedge and ball-bonding. Now it adds a third functionality: the 53XX BDA is now capable of DIE-bonding.

Bondsystem:

Die-sizes:

  • different sizes process-oriented usable

Bondhead:

  • manual Die-Bonding with Touchdown-Detection and programmable Pickup- and Bondforce
  • different Standard-tools usable
  • Bondforcesystem with Voice-Coil
  • contactless electronic Touchdown-Sensor
  • Vacuum and blow-off-gas automatically switched

Chipsource:

  • optional Wafflepacks, Jellypacks or Trays inside the working area 2×2″ applicable

Substrathandling:

  • manual workholder with vacuum or manual clamping, quick change

Bondforce:

  • Bondforce programmable from 5 to 500cN
  • Pickup-force programmable from 5 to 500cN

 

 

 

 

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