DIE Bonders

TRESKY T-3002-FC3 Manual DIE Bonder

A precise, high quality, versatile die bonder & component placer with superior ergonomic design and programmable, high accuracy motorised Z-Drive and bonding force control.
Excellent performance and high reliability makes it ideal for small and medium production and various development applications. The automated Z-Drive with bond force control enables a high repeatability of bond parameters.

The overlapping wafer & bonding levels reduce the necessary worktable movement to a minimum. The special automatic focusing facility compensates the difference between the two microscope working levels. Various video-systems are available for alignment (e.g. Flip-Chip).

Optional equipped with wafer table and die ejector system

ONBoard Solutions offers SMT Production Solutions, Inline Printers, PCB printers, SMT assembly machines, Thermal Reflow Ovens, Wave Soldering, Conformal Coating, PCB Cleaning, Rework, Soldering, Desoldering and Rework Stations, Dispensing Units, Fume Extractor, Static Controls, DIE Bonders, Wire Bonders, Dicing Systems, Wafer Mounting System, Precision Cleaning, Lead free Solder Paste, Leaded Solder paste, Solder Wire, Flux, Epoxies, SMT Adhesives, UV Curable, Underfill, Precision Cleaners, Bonding Wire, Capilliary Tubes, Nozzles, Solder Tips, Air Showers, Pass Boxes, Transfer Hatches, Fan Filter Units, Laminar Flow Cabinets, Straddle Units, Modular Clean Rooms, disposable gloves, sterile gloves, ESD chairs, sticky mats, disposable garments, wipers, disinfectants.