DIE Bonders

Tresky T 3202 Semi-automatic DIE Bonder

 

The T-3202 represents a new generation of electronics assembly equipment, featuring highest possible flexibility and enabling a cost effective solution of a broad variety of applications.

The Die Attach System T-3202 is designed for both development and lower or middle productions runs.

Flexible Windows based software and new highly accurate motion control, together with the proved feature of switching from automatic to manual operation at any time provide easy teach-in programming.

Modular structure and a number of optional equipment enable optimal configuration for the user’s requirement, with the upgrade or retrofitting possibility any time.

ONBoard Solutions offers SMT Production Solutions, Inline Printers, PCB printers, SMT assembly machines, Thermal Reflow Ovens, Wave Soldering, Conformal Coating, PCB Cleaning, Rework, Soldering, Desoldering and Rework Stations, Dispensing Units, Fume Extractor, Static Controls, DIE Bonders, Wire Bonders, Dicing Systems, Wafer Mounting System, Precision Cleaning, Lead free Solder Paste, Leaded Solder paste, Solder Wire, Flux, Epoxies, SMT Adhesives, UV Curable, Underfill, Precision Cleaners, Bonding Wire, Capilliary Tubes, Nozzles, Solder Tips, Air Showers, Pass Boxes, Transfer Hatches, Fan Filter Units, Laminar Flow Cabinets, Straddle Units, Modular Clean Rooms, disposable gloves, sterile gloves, ESD chairs, sticky mats, disposable garments, wipers, disinfectants.