Wafer Bumping & Dicing

7100 Series 2″ and 4″ Spindle System

The 7100 family of 2″ and 4″ spindle dicing systems deliver a high level of affordability and flexibility.

With different models to choose from, each optimized for a specific range of applications, the 7100 Series covers the widest range of applications, offering the lowest possible cost of ownership while providing the most advanced dicing technology available.

Key Advantages:

  • A full range of automatic vision capabilities
  • Advanced hardware platform for high reliability and low maintenance
  • Heavy Duty, cast-iron base structure for superior precision and accuracy
  • Increased yield, throughput and process control
  • Unique multi-panel processing cababilities
  • Special blade wear forecast algorithm
  • User-friendly, Windows XP based Software platform
  • ONBoard Solutions offers SMT Production Solutions, Inline Printers, PCB printers, SMT assembly machines, Thermal Reflow Ovens, Wave Soldering, Conformal Coating, PCB Cleaning, Rework, Soldering, Desoldering and Rework Stations, Dispensing Units, Fume Extractor, Static Controls, DIE Bonders, Wire Bonders, Dicing Systems, Wafer Mounting System, Precision Cleaning, Lead free Solder Paste, Leaded Solder paste, Solder Wire, Flux, Epoxies, SMT Adhesives, UV Curable, Underfill, Precision Cleaners, Bonding Wire, Capilliary Tubes, Nozzles, Solder Tips, Air Showers, Pass Boxes, Transfer Hatches, Fan Filter Units, Laminar Flow Cabinets, Straddle Units, Modular Clean Rooms, disposable gloves, sterile gloves, ESD chairs, sticky mats, disposable garments, wipers, disinfectants.