Wire Bonders & Testers

FS Bondtec logo

F&S Bondtec Semiconductor GmbH, Austria are the
technology leader for desktop bonding equipment.
Research institutes, developing laboratories and small-scale productions are using F&S Bondtec machines around the entire world market.

The Model 56XX Desktop Micro Factory been awarded Editors’ Choice Best Product Award. This 5-in-1 unit allows Wire- and Ribbon bonding as well as Pull-, Shear- and Tweezer-Testing all in one basic machine.

 

 

F&S Bondtec 5310 Gold Ball Bonder

The Gold Ball Bonder 5310 is F&S Bondtec’s entry-level model for bonding gold wires between 17,5 and 50 µm, using the bumping mode as well as the stitchbond mode.

Due to the motor driven Z-axis you work always with repeatable results. Additionally every parameter can be saved to the internal hard disk. The handling, supported by a colour display and the input with a shuttle-wheel make the programming of the machine very easy. The operator can create different kinds of loops with the manipulator system. Operators require only a minimum of training, making the 5310 manual ball bonder the ideal choice for prototype, rework and small-scale production.

The 5310 is perfectly suited for complex bond-tasks, optimal quality and the most favourable price.

 

 

 

F&S Bondtec 5330 Thin Wire Wedge Bonder

All around the world research institutes, developing laboratories and small-scale productions are using F&S Bondtec machines. With the new 5330 F&S Bondtec made the next step to leadership in manual wedge-wedge-bonding.

The Wedge-Wedge Bonder 5330 can process aluminium and gold wires from 17,5 to 75 µm. Due to the new designed clamp it is possible to bond ribbons up to 125µm width. Due to the mechanical manipulator system the operator can create different kind of loops.

The bondhead is equipped with automatic feed- and tail-function which allows optimal, user-friendly bonding. The handling, supported by a colour display and the input with an shuttle-wheel make the programming of the machine very easy. Due to the motor driven Z-axis you work always with repeatable results. Additionally every parameter can be saved to the internal hard disk. Operators require only a minimum of training, making the 5330 the ideal choice for small scale production, laboratory, prototyping, pre-series and repair applications.

The 5330 is perfect suited for complex bond-tasks, optimal quality and the most favourable price.

 

 

 

F&S Bondtec 53xx BDA Ball + Deep Access Wedge Bonder

This 53XX BDA bondhead is the ultimate universal bondhead version. It can be used as a Ballbonder and as well as DA Wedge-Wedge- or DA Ribbon Bonder.

Deep Access area: Ballbonding 12mm, Wedge/Wedge until 20mm (with 1” Tool).

The 53xx is perfect suited for complex bond- tasks. It delivers highest quality at the most favourable price. This ma-chine is the right choiceyou’re your so-phisticated applications.

To watch a product video please click here:

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F&S Bondtec 56xx Desktop Micro Factory Wire Bonder

 

 

F&S Bondtec’ revolutionary Desktop Micro Factory is completely unique on the world market. No other supplier comes even close to offering the features of this bonder: all wire bond processes thanks to exchangeable bond heads; convertibility to pull and shear testers; programmable for fully automatic operation; optional pattern recognition unit.

The F&S Bondtec 56xx Desktop Micro Factory Wire Bonder stays forever young because it grows with the requirements and the technology. The best way to protect your investment.

Technical Details:

Universal base with integrated PC-navigation and Ethernet-connection, Windows-based Bonder software extremely intuitive programming; Single Bond mode for setting individual bonds (manually or automatically) and for repairing; Multi-wire mode for the bonding of complete devices manually or automatically.All bonding parameters can be programmed for any number of bonds or bumps.Programmed wires are shown schematically on the screen and can be selected and grouped with the mouse.

Numerous programmable Loop forms with automatic correction after adjustment by the operator or (optional) image recognition.

Workspace of the mechanical stage 100×100 mm, 60 mm z-stroke. Each bond head includes a miniature color camera for positioning the bonding tool with adapted optics for optimal magnification. The bond head can rotate 360 degrees, so that the work piece does not have to be rotated.

To watch a product video please click  here:
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F&S Bondtec 5600 Automatic Bond Tester

 

5600 Automatic Pull- / Sheartester

The automatic bond tester 5600 complements F&S’ die and wire bonders.

The PC controlled moving table allows any number of bonds to be tested automatically from a stored program. Results can be analysed and output immediately or exported in a number of data base formats for subsequent analysis as desired.

Powerful extended capabilities enable measurements such as force/time or force/distance curves to be made and deliver more data over the quality of the bond tested.

The automatic bond tester comes with interchangable test heads for:

  • Pull Test range: 100cN, 10N and 30N
  • Shear Test range: 50cN, 50N and 500N
  • Peel and tweezer test range: 100cN, 10N and 50N

 

 

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