Wire Bonders & Testers

F&S Bondtec 5330 Thin Wire Wedge Bonder

All around the world research institutes, developing laboratories and small-scale productions are using F&S Bondtec machines. With the new 5330 F&S Bondtec made the next step to leadership in manual wedge-wedge-bonding.

The Wedge-Wedge Bonder 5330 can process aluminium and gold wires from 17,5 to 75 µm. Due to the new designed clamp it is possible to bond ribbons up to 125µm width. Due to the mechanical manipulator system the operator can create different kind of loops.

The bondhead is equipped with automatic feed- and tail-function which allows optimal, user-friendly bonding. The handling, supported by a colour display and the input with an shuttle-wheel make the programming of the machine very easy. Due to the motor driven Z-axis you work always with repeatable results. Additionally every parameter can be saved to the internal hard disk. Operators require only a minimum of training, making the 5330 the ideal choice for small scale production, laboratory, prototyping, pre-series and repair applications.

The 5330 is perfect suited for complex bond-tasks, optimal quality and the most favourable price.

 

 

 

ONBoard Solutions offers SMT Production Solutions, Inline Printers, PCB printers, SMT assembly machines, Thermal Reflow Ovens, Wave Soldering, Conformal Coating, PCB Cleaning, Rework, Soldering, Desoldering and Rework Stations, Dispensing Units, Fume Extractor, Static Controls, DIE Bonders, Wire Bonders, Dicing Systems, Wafer Mounting System, Precision Cleaning, Lead free Solder Paste, Leaded Solder paste, Solder Wire, Flux, Epoxies, SMT Adhesives, UV Curable, Underfill, Precision Cleaners, Bonding Wire, Capilliary Tubes, Nozzles, Solder Tips, Air Showers, Pass Boxes, Transfer Hatches, Fan Filter Units, Laminar Flow Cabinets, Straddle Units, Modular Clean Rooms, disposable gloves, sterile gloves, ESD chairs, sticky mats, disposable garments, wipers, disinfectants.