Wire Bonders & Testers

F&S Bondtec 5310 Gold Ball Bonder

The Gold Ball Bonder 5310 is F&S Bondtec’s entry-level model for bonding gold wires between 17,5 and 50 µm, using the bumping mode as well as the stitchbond mode.

Due to the motor driven Z-axis you work always with repeatable results. Additionally every parameter can be saved to the internal hard disk. The handling, supported by a colour display and the input with a shuttle-wheel make the programming of the machine very easy. The operator can create different kinds of loops with the manipulator system. Operators require only a minimum of training, making the 5310 manual ball bonder the ideal choice for prototype, rework and small-scale production.

The 5310 is perfectly suited for complex bond-tasks, optimal quality and the most favourable price.




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