Wire Bonders & Testers

F&S Bondtec 53xx BDA Ball + Deep Access Wedge Bonder

This 53XX BDA bondhead is the ultimate universal bondhead version. It can be used as a Ballbonder and as well as DA Wedge-Wedge- or DA Ribbon Bonder.

Deep Access area: Ballbonding 12mm, Wedge/Wedge until 20mm (with 1” Tool).

The 53xx is perfect suited for complex bond- tasks. It delivers highest quality at the most favourable price. This ma-chine is the right choiceyou’re your so-phisticated applications.

To watch a product video please click here:

youtube-icon-400x400

 

 

 

 

 

ONBoard Solutions offers SMT Production Solutions, Inline Printers, PCB printers, SMT assembly machines, Thermal Reflow Ovens, Wave Soldering, Conformal Coating, PCB Cleaning, Rework, Soldering, Desoldering and Rework Stations, Dispensing Units, Fume Extractor, Static Controls, DIE Bonders, Wire Bonders, Dicing Systems, Wafer Mounting System, Precision Cleaning, Lead free Solder Paste, Leaded Solder paste, Solder Wire, Flux, Epoxies, SMT Adhesives, UV Curable, Underfill, Precision Cleaners, Bonding Wire, Capilliary Tubes, Nozzles, Solder Tips, Air Showers, Pass Boxes, Transfer Hatches, Fan Filter Units, Laminar Flow Cabinets, Straddle Units, Modular Clean Rooms, disposable gloves, sterile gloves, ESD chairs, sticky mats, disposable garments, wipers, disinfectants.