Pillarhouse Selective Soldering

Pillarhouse continues to be a leading force in the selective soldering industry, dedicated to the ongoing development of pioneering technologies to reflect and match the needs of an ever-changing marketplace.

Offering a wide range of machine options to cover the complexity of global demand for electronics production, Pillarhouse combine engineering experience, software development and future thinking to provide cost effective and reliable selective soldering machines and equipment.

Pillarhouse Pilot

The all new ultra-low cost PILOT machine has been designed as an entry level, hand load, benchtop machine for small to medium batch manufacturers combining high levels of production flexibility with economic running costs.

Offered with two universal, quick change tooling carriers, each one can be exchanged to optimise cycle time. Each carrier is capable of handling a board size up to 330mm x 250mm.

The PILOT incorporates as standard, our patented Drop-Jet fluxer for quick, accurate flux deposition. An optional bottom-side IR preheat is also available, this is particularly useful when processing multi-layer PCB’s or using water based flux types.

Specifications

  • Height With monitor 1050mm / 42”,
    with cowling 750mm / 29” – without 695mm / 27”
  • Width: With flux bottles 1090mm / 43”- without 915mm / 36”
    with solder bath out 1380mm / 54”
  • Depth: 700mm / 28” to 963mm / 38” with keypad tray out
  • Weight: 170kg (table-top format)
  • Board size: 330mm x 250mm / 13″ x 10″
  • Edge clearance: Above / below 3mm
  • Height clearance: Above / below 40mm nominal
  • Solder: Most commonly used solder types – including lead-free
  • Solder pot capacity: 6kg
  • Applicators: AP style – 2.5mm to 16mm dia.
    Extended AP style – 2.5mm to 20mm dia.
    Micro nozzle – 1.5mm to 2.5mm
    Jet-Tip style – 6mm to 20mm dia.
    Special dedicated nozzles available upon request
  • Flux: Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurised and inerted system, optional water-soluble system available
  • X, Y & Z Axis resolution: 0.1mm
  • Repeatability: +/- 0.05mm
  • Nitrogen usage: 30 litres gas/min. 5 bar pressure
  • Nitrogen purity: 99.99% or better
  • Power supplies: Single phase + PE
  • Voltage: 208V – 250V
  • Frequency: 50/60Hz
  • Power: 4kVA including bottom-side IR preheat
  • Transport: Hand load
  • Tooling: Integral adjustable board guides, includes finger extensions and board clamps
  • Programming: Windows® based PillarCOMM Lite ‘Point & Click’ interface
Pillarhouse Jade MarkII Standalone

 

This entry-level single point selective soldering system is designed to meet the needs of the small/medium batch manufacturer who requires high levels of production flexibility and soldering quality at a very low cost.

The soldering process is enhanced by a hot Nitrogen curtain which provides an inert atmosphere. This method of soldering also assists in the prevention of oxidisation and provides a local preheat to the joint, thus reducing thermal shock to localised components.

The Jade MKII is controlled by a PC, through PillarCOMM, a Windows® based ‘Point & Click’ interface with PCB image display.  Additionally, the PillarPAD offline package allows the operator to produce programs independently from the machine using Gerber data.

 

Specifications

  • Height: 1403mm / 55” – excluding light stack
  • Width: 1000mm / 40“
  • Depth: 1351mm / 53”
  • Board size: 457mm x 508mm / 18”x 20” (larger PCB size available upon request)
  • Edge clearance: Above / below 3mm
  • Height clearance: Above / below 40mm nominal
    Above 190mm – special application
  • Solder: Most commonly used solder types – including lead-free
  • Solder pot capacity: 8kg
  • Applicators: AP style – 2.5mm to 16mm dia.
    Extended AP style – 2.5mm to 20mm dia.
    Micro nozzle – 1.5mm to 2.5mm
    Jet-Tip style – 6mm to 20mm dia.
    Jet-Wave nozzle – up to 25mm width
    Special dedicated nozzles available upon request
  • Flux: Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurised and inerted system, optional water soluble system available
  • X, Y & Z Axis resolution: 0.1mm
  • Repeatability: +/- 0.05mm
  • Nitrogen usage: 35 litres gas/min. 5 bar pressure
  • Nitrogen purity: 99.995% or better
  • Air supply pressure: 5 bar / 72 psi
  • Power supplies: Single phase + PE
  • Voltage: 208V – 250V
  • Frequency: 50/60Hz
  • Power : 4kVA
  • Power with IR preheat: 6.5kVA – Top-side
    8kVA – Top with bottom-side ring heater
  • Transport: Hand load
  • Tooling: Integral adjustable board guides, includes finger extensions and board clamps
  • Programming: PillarCOMM Windows® based ‘Point & Click’ interface
Pillarhouse Jade Pro

The Jade PRO is a hand load system, incorporating a universally adjustable tooling carrier capable of accommodating PCBs or pallets up to 457x508mm.
In its basic format, the Jade PRO is configured with a single solder bath. In the Jade PRO Duplex guise, the machine can be configured with twin adjacent solder baths on independent Z axis drives. This achieves increased production flexibility by permitting use of two different nozzle tip sizes which can be allocated as process requirements dictate within any particular area on a PCB.

All of the above Jade PRO configurations can be offered with optional automatic heated solder bath change stations. Using this system the non-operational solder bath and pump system is stationed at one of two heated park positions located at either side of the main machine.

This heated station maintains the correct solder temperature within the bath that is idle, so that when changeover occurs, the replacement bath can resume immediate production. A single automatic solder bath change station is identified as a PLUS configuration, whilst twin stations (located at both sides of the machine) are identified as PLUS PLUS configurations.
On this basis Duplex machines with the PLUS PLUS identity will operate with 4 individual solder bath and pump systems.

The Jade PRO series is controlled by a PC, through PillarCOMM, a Windows® based ‘Point & Click’ interface with a PCB image display.

Additionally our PillarPAD offline programming package allows the operator to produce programs independently from the machine using Gerber data.

Specifications

  • Height: 1230mm / 48” to 2025mm / 80″- with light stack
  • Width: 1250mm / 49“ to 1700mm / 67”- with side auto changer
  • Depth: 1495mm / 59”
    1720mm / 68” with flux bottles
  • Board size: 457mm x 508mm / 18”x 20”
  • Edge clearance: Above / below 3mm
  • Height clearance: Above / below 40mm nominal 90mm max. top-side only
  • Solder: Most commonly used solder types – including lead-free
  • Solder pot capacity: 20kg standard – 30kg large bath
  • Applicators: AP style – 2.5mm to 16mm dia.
    Extended AP style – 2.5mm to 20mm dia.
    Micro nozzle – 1.5mm to 2.5mm
    Jet-Tip style – 6mm to 40mm dia.
    Jet-Wave style – up to 25mm width
    Special dedicated nozzles available upon request
  • Flux: Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurised and inerted system, optional water-soluble system available
  • X, Y & Z Axis resolution: 0.1mm
  • Repeatability: +/- 0.05mm
  • Nitrogen usage: Up to 40 litres gas/min per bath using single bath with standard AP solder nozzle, 5 bar pressure.
    Up to 80 litres gas/min using duplex twin bath configuration. Refer to Pillarhouse for Nitrogen usage requirement with dedicated multi-tube nozzle assemblies.
  • Nitrogen purity: 99.995% or better
  • Air supply pressure: 5 bar / 72 psi
  • Power supplies: Three-phase + neutral + PE
  • Voltage: 230V phase to neutral / 400V phase to phase
  • Frequency: 50/60Hz
  • Power : Maximum 9kVA per phase machine configuration dependent
  • Transport: Hand load
  • Tooling: Integral adjustable board guides, includes finger extensions and board clamps.
  • Programming: PillarCOMM Windows® based ‘Point & Click’ interface

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