Fluxes

We offer two off the fluxes supplied by Inventec. One is for rework processes, general and BGA. The other is a VOC Free no-clean product for spray fluxing used in wave machines and selective machines.

 

NEW – Inventec Ecofrec 205

ECOFREC 205 provides excellent soldering in lead-free as well in leaded, both in wave and in selective wave soldering applications.

  • Excellent through-hole wetting
  • No microballing Compatible with different PCB lead-free finishing as Ni/Au, Sn, Ag, HAL and OSP, even after prior heat cycle.
  • This flux is recommended for lead free soldering with alloys such as SAC, SnCu, etc…, as well as those containing lead
  • This flux also has passed the stringent BONO test for post process residue reliability. This gives peace of mind on reliability of the no-clean residues not impacting on final product reliability.

205-Spec1

205-Tests

 

NEW – Inventec Ecofrec 320 VOC Free Flux

ECOFREC 320 is a low residue, no-clean, VOC (Volatile Organic Compound) free flux, for lead and lead free application.

  • Excellent wettability and hole filling on any finish
    No solder ball, no alloy projection
  • Non visible residue High reliability : high SIR values
  • Passes stringent BONO Test Reliability test.
  • VOC free flux: zero solvent, not flammable as opposed to some other so-called VOC free fluxes on the market.
  • The activation system of ECOFREC 320 is eliminated after wave soldering. Free of halide (Fluoride, Chloride, Bromide) and halogen PCB cleaning after soldering is not necessary due to its very low solids content.

320-Spec1

320-Spec 2

Inventec Ecofrec 303 VOC-Free NC Flux

ECOFREC  303 is a low residue, no-clean, VOC free flux, with excellent soldering performance on any finish.
This flux is recommended for lead free soldering with alloys such as SAC, SnCu, etc…, as well as those containing lead.
ECOFREC 303 is a true VOC free flux. Therefore, it is not flammable as opposed to some other so-called VOC free fluxes on the market.
Compared to low residue alcool-based fluxes, ECOFRECTM 303 requires less flux and thus gives a lower cost per PCB.

Inventec TF49 Gel flux for rework

ECOFREC TF49 is a tacky flux paste designed for soldering and rework of traditional components and SMDs. ECOFREC TF49 is particularly efficient for lead and lead free ball attach and BGA repair. After reflow, the residue is clear and colorless. The ECOFREC TF49 also has passed the tough reliability test known as BONO Test. This ensures stable and reliability post soldering in terms of remaining flux residues over less stringent IPC SIR test qualification

ONBoard Solutions offers SMT Production Solutions, Inline Printers, PCB printers, SMT assembly machines, Thermal Reflow Ovens, Wave Soldering, Conformal Coating, PCB Cleaning, Rework, Soldering, Desoldering and Rework Stations, Dispensing Units, Fume Extractor, Static Controls, DIE Bonders, Wire Bonders, Dicing Systems, Wafer Mounting System, Precision Cleaning, Lead free Solder Paste, Leaded Solder paste, Solder Wire, Flux, Epoxies, SMT Adhesives, UV Curable, Underfill, Precision Cleaners, Bonding Wire, Capilliary Tubes, Nozzles, Solder Tips, Air Showers, Pass Boxes, Transfer Hatches, Fan Filter Units, Laminar Flow Cabinets, Straddle Units, Modular Clean Rooms, disposable gloves, sterile gloves, ESD chairs, sticky mats, disposable garments, wipers, disinfectants.