Inventec TF49 Gel flux for rework

ECOFREC TF49 is a tacky flux paste designed for soldering and rework of traditional components and SMDs. ECOFREC TF49 is particularly efficient for lead and lead free ball attach and BGA repair. After reflow, the residue is clear and colorless. The ECOFREC TF49 also has passed the tough reliability test known as BONO Test. This ensures stable and reliability post soldering in terms of remaining flux residues over less stringent IPC SIR test qualification

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