Showing 17–32 of 94 results
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Ecorel Easy 862 T4
20 – 38 micron Mesh size for ultra fine pitch printing
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Ecorel Free LT 140-18
Recommended for temperature sensitive components. Excellent printing capabilities
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Epotek 301
Optically clear, room temp or mild heat cure and low viscosity. For applications like optical lenses bonding , underfill , sealing small sensor potting, medical device. Adhesion to glass, quartz, metals, most plastics.NASA Approved, low out gassing. Max mix volume 25gm.
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Epotek 301-2
Optically clear , long pot life , UV resistant up to 17 Days continuous UV exposure, room temp or mild heat cure for applications like optical lenses bonding , optical splicing , glob top, underfill , wire bond encapsulation , sealing small sensor potting. Adhesion to glass, quartz, metals, most plastics.NASA Approved, low out gassing.
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Epotek 301-2FL
Optically clear , long port life flexible version of Epotek 301-2. Applications for optical lenses bonding , optical splicing , glob top, wire bond encapsulation , sealing small sensor potting, max 25 gm mix mass.
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Epotek 302
Optically clear , fast gel and cure in 2-3 hours, optical lense bonding , optical splicing , sealing small sensor potting, max 25 gm shot mix mass.
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Epotek 302-3M
Excellent water , chemical and solvent resistance , acetone, up to 10% nitric Acid, Hexane and dichloromethane. Suggested applications Fibre-Optics, small volume potting, bonding to glass, SST , quartz, Kovar and ceramic substrates, Optically Transmissive VIS/NIR range 350-1550nm for optical applications Max 25gm per mix volume.
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Epotek 302-3M-BLK
Excellent water , chemical and solvent resistance , acetone, up to 10% nitric Acid, Hexane and dichloromethane. Suggested applications Fibre-Optics, small volume potting, bonding to glass, SST , quartz, Kovar and ceramic substrates. Opaque black version of Epotek 302-3M
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Epotek 353ND
High end reliable epoxy for sealing, bonding, Fiber optic Termination Ferrals ,- Approved by TE connectivity for use in there connectors, Sensor Encapsulation, Piezo Bonding, Coil-Ferrite Bonding, SST, Magnets. Exhibits high Chemical resistance, high operational temperatures. NASA Approved, low out gassing.
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Epotek 730
High quality general purpose Epoxy Structural and Potting Adhesive. Room Temperature Cure to mild heat cure. Use cases are sealing, potting or encapsulation in semiconductor, electronics assemblies, optical , medical device-equipment applications.
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Epotek 730-110
High quality general purpose Epoxy Structural and Potting Adhesive. Room Temperature Cure to mild heat cure. Use cases are sealing, potting or encapsulation in semiconductor, electronics assemblies, optical , medical device-equipment applications.
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Epotek 730-110-BLK
High quality general purpose Epoxy Structural and Potting Adhesive. Room Temperature Cure to mild heat cure. Use cases are sealing, potting or encapsulation in semiconductor, electronics assemblies, optical , medical device-equipment applications. Black color version of Epotek 730-110.
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Epotek 730-BLK
High quality general purpose Epoxy Structural and Potting Adhesive. Room Temperature Cure to mild heat cure. Use cases are sealing, potting or encapsulation in semiconductor, electronics assemblies, optical , medical device-equipment applications. Black version of Epotek 730.
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Epotek EJ2189
This adhesive is electrically conductive and thermally conductive , silver filled. Smooth Thixotropic paste allows for easy dispensing, stamping and hand application. Cure is room temp and heat curable option. Applications for EMI seals, RF shielding, ITO interconnects, LCD connects, cryogenic applications, die attach.
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Epotek EJ2189-LV
This adhesive is electrically conductive and thermally conductive , silver filled. Cure is room temp and heat curable option. Applications for EMI seals, RF shielding, ITO interconnects, LCD connects, cryogenic applications, die attach.Lower viscosity version of Epotek EJ2189.
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Epotek EK2000
Material is electrically and Thermally conductive. Enables high performance thermal interconnections. Low Viscosity and high thixotropy enables easy dispensing. Applications are for power electronics, high power LED Thermal Management, Solar CPV module thermal interconnects, higher flexibility than solder for thermal miss-match applications