Low Voiding  solder paste with 20 - 38 micron Mesh size for ultra fine pitch printing

ECOREL FREE 305-16LVD is a no clean, lead-free solder paste developed with the reliable chemistry of the ECOREL range.

• Ultra low voids percentage and reduced voids size in large contact area components
• Very good wetting on any surface finish including OSP
• Transparent and colorless residue even after multiple reflow cycles
• Good first pass yield testability in ICT

ECOREL FREE 305-16LVD is able to achieve very low level of voiding especially for power components (QFN, DPAK, etc).

Unit Size - 500gr jar
Alloy - SAC 305
Melting Point - 217C

Ordering Size-
1 Jar