This adhesive is electrically conductive and thermally conductive , silver filled. Smooth Thixotropic paste allows for easy dispensing, stamping and hand application. Cure is room temp and heat curable option.  Applications for EMI seals, RF shielding, ITO interconnects, LCD connects, cryogenic applications, die attach.

This adhesive is electrically conductive and thermally conductive , silver filled. Smooth Thixotropic paste allows for easy dispensing, stamping and hand application. Cure is room temp and heat curable option.  Applications for EMI seals, RF shielding, ITO interconnects, LCD connects, cryogenic applications, die attach.