Epotek ONBoard SolutionsEpotek ONBoard Solutions

Single Component polymide, high temperature silver filled, electrically conductive and thermally conductive adhesive. Applications for die attach, microelectronics packaging.

Single Component polymide, high temperature silver filled, electrically conductive and thermally conductive adhesive. Applications for die attach, microelectronics packaging.



Epotek P1011-ST

$0.00

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