Epotek P1011
Single Component polymide , high temperature silver filled, electrically conductive and thermally conductive adhesive. Applications for die attach, microelectronics packaging. Targets stencil printing applications and dispensing.
Single Component polymide , high temperature silver filled, electrically conductive and thermally conductive adhesive. Applications for die attach, microelectronics packaging. Targets stencil printing applications and dispensing.
Epotek P1011
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