Tresky 3002 PRO DIE Bonder ONBoard Solutions AustraliaTresky 3002 PRO DIE Bonder ONBoard Solutions Australia

Ultra Flexible DIE Bonder for most applications

Advanced Flexible Desk Die Bonder

The T-3002-PRO series is Tresky’s most flexible die bonding platform.

The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options.
The PRO incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height.

equiped with Tresky’s die ejector system for pick-up from wafer.

Application Packages:

  • Flip-Chip
  • Eutectic
  • Pick from Wafer
  • High Bondforce Force
  • Ultrasonic
  • Flip-Chip


T3002 PRO

$0.00

Ultra Flexible DIE Bonder for most applications

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