T6000 L/G Flexible High Precission Bonder
Fully Automated DIE Bonder
T-6000-L/G Flexible High Precision Automatic Die Bonder
The T-6000-L is fully automated all-purpose system built on a sophisticated granite gantry and high precision motion control system.
T-6000-L can be upgraded with new loader and unloader modules. and can be customized to suit all market needs.
This system offers our customers the opportunity to grow from a manual manufacturing process to a fully automated process.
- Adhesive Bonding
- Thermosonic Flip-Chip Bonding
- DIE Attach
- Flip Chip Bonding
T6000 L/G Flexible High Precission Bonder
$0.00
Fully Automated DIE Bonder
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